GENERAL INFORMATION

ESREF 2003, the 14th European Symposium on Reliability of Electron Devices will take place at Bordeaux (France) from 6th to 10th October 2003.

This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials, devices and circuits for microelectronics. It provides a European forum for developing all aspects of reliability management and advanced analysis techniques for present and future semiconductor applications.

The scope of the EOBT, Electron and Optical Beam Test Conference is included in the ESREF Conference.

This event is organised by the IXL Laboratory (UMR CNRS, ENSEIRB, University Bordeaux 1) and ADERA with the technical co-sponsorship of IEEE - Electron Devices Society and ANADEF association (French association of industrial labs working in failure analysis, web site : http://www.anadef.org/) .

 

LOCATION OF THE CONFERENCE :

PALATIUM-ARCACHON (50 km from Bordeaux-Airport)

Phone : 33 (0)5 56 22 47 00 - Fax : 33 (0)5 56 22 55 55

e-mail : palais.des.congres.arcachon@wanadoo.fr

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SUBMISSION OF PAPERS

The deadline for the submission of three page-extended summaries (including figures) is March 31^st, 2003. The title page must include a five-line abstract, the complete address, the fax number and e-mail address of the corresponding author and the preference for oral or poster presentation. Please note that abstracts and papers must be in English.

Authors are requested to send an electronic file (in Adobe Acrobat PDF format) of the summary to the Technical Programme chair at :

esref@ixl.u-bordeaux.fr

 

DEADLINES

31 March 2003          Submission of summary

28 May 2003              Notification of paper acceptance

27 June 2003             Submission of final manuscript

The ESREF 2003 proceedings will be published as a special issue of the journal Microelectronics Reliability and on CD-ROM by Elsevier Science.

18 July 2003              Receipt of the final paper at Elsevier Science (UK)

 

For further information concerning the Scientific Program, please contact :

Nathalie LABAT - Frédéric VERDIER

Université Bordeaux 1 - Laboratoire IXL

351 cours de la Libération - 33405 TALENCE CEDEX - FRANCE

Phone : 33 (0)5 56 84 65 45 - Fax : 33 (0)5 56 37 15 45

e-mail : esref@ixl.u-bordeaux.fr

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EQUIPMENT EXHIBITION

The Symposium will feature the latest in service providers, equipment manufacturers and suppliers.

A large exhibit floor will give the opportunity to key-vendors to represent the core business area in these fields.

For further information concerning the equipment exhibition, please contact :

 A. BELLIER - ADERA (France) - mailto:esref@adera.fr

Centre Condorcet, 162 avenue Albert Schweitzer - F-33608 PESSAC CEDEX

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TECHNICAL PROGRAM

The conference will concentrate on two main areas of interest in electronics concerning designers, manufacturers and users:

- Strategy for Quality and Reliability Assessment during Product Development and Life Cycle

- Advanced Analysis Techniques for Technologies and Product Evaluation

Tutorials by experts will provide reviews and updates of selected topics of actual interest. Invited papers will introduce the main stream topics.

The Technical Programme Committee is inviting submission of papers that address one or more of the following topics:

Quality and Reliability Techniques for Components and Systems ·        Reliability indicators and early detection, ·        Reliability test structures, ·        Limits to accelerated tests, ·        Yield/reliability relationship, ·        Screening methods and burn-in, ·        HAST , HASS, ·        Field reliability..	Failure Mechanisms in new materials and devices ·        Hot carriers, ·        Passivation stability, ·        Metal migration and interaction, ·        High-k dielectrics, Cu interconnects, ·        Non-volatile and programmable device, ·        MEMS, Sensors..
Reliability models and simulations ·        Characterisation of defects, ·        Defect models, ·        Simulation of reliability related circuit constraints	Advanced Failure Analysis: Defect Detection and Analysis ·        Electron, ion and laser beam techniques, ·        Backside techniques, ·        Scanning probe techniques, SCM, ·        Acoustic microscopy, ·        Electrical and thermal characterization, ·        Sample preparation, construction analysis, ·        Failure analysis: case studies..
Power and High Temperature Devices ·        Power Devices Reliability ·        Smart-power devices, IGBT, thyristors, ·        Thermal management.
Photonics Reliability ·       Optoelectronics and laser devices, ·       Passive elements and modules, MOEMS. Compound semiconductors reliability ·        Microwave and millimeter wave components, ·        Wide band-gap semiconductors.	Packaging and Assembly Reliability ·        Bonding, solders and joints, ·        High densities assemblies, MCM, ·        BGA, CSP, flip-chip, ·        Connectors..

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COMMITTEES AND SUB-COMMITTEES

STEERING COMMITTEE

COMMITTEES AND SUBCOMMITTES

PROGRAM COMMITTEE

Conference Chairman :

A. TOUBOUL           - IXL, University of Bordeaux (France)

Technical Program Chair :

N. LABAT                 - IXL, University of Bordeaux (France)

J.-C. CLEMENT       - ANADEF – Thales R&T

Conference Scientific Support :

J.L. AUCOUTURIER - IXL, University of Bordeaux (France)

Y. DANTO                 - IXL, University of Bordeaux (France)

Scientific Secretariat :

F. VERDIER              - IXL, University of Bordeaux (France)

Industrial Exhibition :

A. BELLIER              - ADERA (France)

Organisation Secretariat :

I. VOIRIN (esref@adera.fr)

ADERA (Association pour le Développement de l'Enseignement et des Recherches auprès des Universités, des Centres de recherche et des Entreprises d'Aquitaine)

Centre Condorcet - B.P. 196 - 162 avenue Albert Schweitzer - F-33608 PESSAC CEDEX

COMMITTEES AND SUBCOMMITTES

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