TECHNICAL COMMITTEES AND SUB-COMMITTEES
Quality and Reliability Techniques for Components and System
Chairmen: M. Catelani W. De Ceuninck |
Failure Mechanisms in Silicon devices
Chairmen: N.Stojadinovic C.Caprile |
Failure Mechanisms in Compound Semiconductors devices
Chairmen: N. Labat R. Menozzi |
Non-volatile and programmable device
reliability
Chairman: P. Pavan |
Power Devices Reliability
Chairmen: M.Ciappa G. Busatto |
Photonics Reliability Chairmen: J. Arnaud J.M.Dumas |
Packaging and Assembly Reliability
Chairman: C.Cognetti |
Advanced Failure Analysis : Defect Detection
and Analysis
Chairmen: G.Queirolo P.Perdu |
EOBT
Chairmen: R. Cramer W. Claeys |
ESD
Chairmen: G.Meneghesso T. Mouthaan |
MEMS/MOEMS (Special Session)
Chairman: I. De Wolf E. Wolfgang |
Microelectronic Realibility Anniversary (Special Session)
Chairman: N.Stojadinovic |
CORRESPONDING
MEMBERS AND REVIEWERS
ESD
Giuseppe Croce - ST Microelectronics, Milan –
(Italy)
Antonio Andreini - STMicroelectronics, Milan – (Italy)
Christian Russ, Sarnoff Corporation, Princeton, NJ (USA)
Fred Kuper, Philips Semiconductors, Nijmegen, (The Netherlands)
Wolfgang Stadler, Infineon Technologies, Munich, (Germany)
Joachim Reiner EMPA
(Switzerland)
Photonic
Reliability
Boisrobert Christian, University of Nantes (France)
Caloz François , Diamond (Switzerland)
Pusch Reinhard, Alcatel (Germany)
Villa Marco, Pirelli (Italy)
Quality
and Reliability Techniques for Components and System
Cathérine Dekeuleire - Alcatel Microelectronics – Oudenaarde – (Belgium)
Kristof Croes –Xpeqt – Tessenderlo – (Belgium)
Failure
Mechanisms in Silicon devices
Gerard Ghibaudo, LPCS/ENSERG,
(France)
Sima Dimitrijev, Griffith University (Australia)
Xavier Aymerich, University of Barcelona (Spain)
Roland Thewes, Infineon Technologies (Germany)
Ton Mouthaan, University of Twente (The Netherlands)
Luc De Schepper, Limburgs University (Belgium)
Hiroshi Iwai, Tokyo Institite of Technology (Japan)
Dimitris Kouvatsos, IMEL Demokritos (Greece)
Lucile Arnaud, LETI/CEA (France)
Merlyne De Souza, De Montfort University (UK)
Gabriella Ghidini - STMicroelectronics Agrate
(MI) –( Italy)
Andrea Scorzoni, University of Perugia (Italy)
Bruno Neri, University of Pisa (Italy)
Non-volatile
and programmable device reliability
Gabriella Ghidini - STMicroelectronics - Agrate
(MI) – (Italy)
Dirk Wellekens - IMEC – (Belgium)
Luigi Pantisano - IMEC - (Belgium)
Andrea Scarpa - Philips Semiconductors - Nijmegen, (The Netherlands)
Packaging
and Assembly Reliability
Luc
Petit - ST Microelectronics (France)
Isabelle Baudry - ST Microelectronics (France)
Tong Yan Tee - ST Microelectronics (Singapore)
Valter Motta - ST Microelectronics
(Italy)
Failure
Mechanisms in Compound Semiconductors devices
Jean-Michel Dumas, ENSIL, Université de Limoges (France)
Hans L. Hartnagel , TU Darmstadt (Germany)
Jean-Luc Muraro, Alcatel Space Industry (France)
Paolo
Cova University of Parma (Italy)
Peter Ersland M/A-COM
(USA)
Michael Dammann Fraunhofer Inst. IAF – Freiburg (Germany)
Tim Henderson TriQuint Texas (USA)
Power
Devices Reliability
Paolo
Dovano, Fiat (Italy)
Frederic Lecoq, Renault (France)
Wolfgang Wondrak, Daimler Chrysler (Germany)
Yasushi Yamada, Toyota (J)
Gerard Coquery, INRETS (France)
Paolo
Cova, Uni Parma (Italy)
Christian Zardini, Uni Bordeaux (France)
Luigi Fratelli, Ansaldo Breda (Italy)
Norbert Seliger, Siemens (Germany)
Hermann Berg, Eupec (Germany)
Ferruccio
Frisina, ST Microelectronics (Italy)
Raymond Zehringer, ABB (CH)
EOBT
Alain Cornet, University of Louvain (Belgium)
Stefan Dilhaire, University Bordeaux I (France)
Pascal Fouillat University Bordeaux I (France)
Hiromu Fujioka Osaka University (Japan)
Ralf Heiderhoff ,University of Wuppertal (Germany)
Siegfried Görlich Infineon Technologies (Germany)
Wolfgang Mertin University of Duisburg, (Germany)
Jacob C.H. Phang National University of Singapore
Antonio Rubio University Polytechnica of Barcelona (Spain)
Gerald Haller ST Rousset (France)
Moyra Mc Manus IBM Research, Yorktown Heights (USA)
Bernard Picard ATMEL Rousset (France )
Jerome Touzel INFINEON Munich (Germany )
Romain Desplats CNES Toulouse (France)
Philippe Descamp PHILIPS Caen (France)
Christophe Goupil PHILIPS Caen (France)
Bernd Ebersberger INFINEON Munich (Germany )
Candida Caprile ST Agrate (Italy)
MEMS
Jürgen Villain
FHA Augsburg (Germany)
Gerhard Wachutka Technical University of Munich (Germany)
Roman Szeloch Wroclaw University of
Technology (Poland)
Vittorio Foglietti CNR-IESS
(Italy)
Francis Pressecq CNES (France)