O. KARIM, C. SCHAEFFER, B. MALLET, M. COYAUD, E. GIMET, "Power module integrated cooling design using CFD simulation", Industry Applications Conference, 2001, Thirty-Sixth IAS Annual Meeting, Vol. 3, 30 Sept.-4 Oct. 2001, pp. 1925-1930.

O. KARIM, C. SCHAEFFER, B. MALLET, M. COYAUD, E. GIMET, "Power module integrated cooling design using CFD simulation", Industry Applications Conference, 2001, Thirty-Sixth IAS Annual Meeting, Vol. 3, 30 Sept.-4 Oct. 2001, pp. 1925-1930. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART565]

Info : REPONSE 2, le 13/07/2004.

Titre : O. KARIM, C. SCHAEFFER, B. MALLET, M. COYAUD, E. GIMET, Power module integrated cooling design using CFD simulation, Industry Applications Conference, 2001, Thirty-Sixth IAS Annual Meeting, Vol. 3, 30 Sept.-4 Oct. 2001, pp. 1925-1930.

Cité dans : [DIV436]  Recherche sur l'auteur Martin COYAUD, juillet 2004.
Cité dans : [CONF017] IAS, World Conference on Industrial Applications of Electrical Energy, octobre 2003.

Auteur : Karim, O. (Lab. d'Electrotechnique De Grenoble INPG/UJF-CNRS.UMR 5529 ENSIEG, 38402 Saint Martin d'Heres Cedex, France)
Auteur : Schaeffer, C.
Auteur : Mallet, B.
Auteur : Coyaud, M.
Auteur : Gimet, E.

Meeting : 36th IAS Annual Meeting -Conference Record of the 2001 Industry Applications.
Location : Chicago, IL, United States
Date : 30 Sep 2001-04 Oct 2001

Source : Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)
Volume : 3
Date : 2001
Pages : 1925 - 1930 (IEEE cat n 01CH37248)
CODEN : CIASDZ
ISSN : 0197-2618
Année : 2001
Meeting_Number : 58807
Document_Type : Conference Article
Treatment_Code : Application; Theoretical
Language : English
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Abstract :
Thermal grease used in classical power module water-cooling takes 40 percent of the water-cooled heat sink thermal resistance. This part which belong to conduction phenomena can be suppressed using a direct cooling method. In this paper the basic conduction term provided by the component packaging is firstly determined, using several methods. Then mini water-cooled channels are directly machined in a standard power module baseplate, taking into account mechanical and technological constraints. In the same way a CFD tool, FLOTHERM from Flomerics is used in order to improve the equipment performances such us a low junction to ambient thermal resistance, that approaches the power module own thermal resistance, a low pressure drop, a high dissipated power and a low gradient in coolant temperature. The equipment thermal and electrical behaviors are finally compared to a typical equipment including a power module and a cooling device mounted with thermal grease utilisation.

Références : 9 Refs.

Accession_Number : 2001(53):1946 COMPENDEX

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