| The 3rd THERMINIC Workshop | ||
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21-23 September 1997, Cannes, France |
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SUMMARY: The Third Therminic Workshop met in Cannes from September 21 to 23 1997. The workshop was organized by TIMA Laboratory and the TU Budapest, sponsored by the IEEE Computer Society, Test Technology Technical Committee, the European Commision DG III, the US Navy Office of Naval Research Europe (ONREUR) in cooperation with the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT Projects and with the European Test Technology Technical Committee and with SPIE (the Society of Photo-Optical Instrumentation Engineers).
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This workshop gathered 72 submissions from around the world, the program committee accepted 28 contributions for oral presentation and 33 ones for poster presentation. |
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| Program overview |
Sunday 21st September 1997 |
Monday 22nd September 1997 |
Tuesday 23rd September 1997 |
|---|---|---|
| Arrival | 8:40
Session 2: THERMAL AND ELECTRO-THERMAL MODELLING AND SIMULATION |
9:00 Invited Talk |
| 14:00 Registration | 11:00 Coffee | 9:40 Coffee |
| 15:00 Welcome address | 11:20 Vendor presentations | 10:00
Session 4: SENSORS AND ACTUATORS |
| 15:10 Opening adress | 12:30 Lunch | 12:15 Lunch |
| 15:20 Invited Talk | 14:00 Free Time | 14:00
Session 5: MEASURING THERMAL MATERIAL PARAMETERS |
| 16:00 Coffee | ||
| 16:20
Session 1: EVALUATION OF THERMAL MEASUREMENTS |
16:00
Session 3: TEMPERATURE MAPPING |
15:40
Special Session: DELPHI/SPEED |
| 17:40 Coffee | 17:20 Coffee | 16:20 Closing Remarks |
| 18:00 Poster Session 1 | 18:00 Poster Session 2 | |
| 19:30 Reception | 19:00 Banquet | |
| 20:30
Panel: THERMAL MANAGEMENT: A LONELY FIGHT OR CONCURRENT ENGINEERING ? |
| Detailed program |
Sunday 21st September | ||
|---|---|---|
| 14:00 | Registration | |
| 15:00 | Welcome
address
B. Courtois |
|
| 15:10 | Opening
address
H. Forster |
|
| 15:20 | Invited
talk
D. Agonafer Chair: H. Forster |
APPLICATION OF COMPUTATIONAL FLUID DYNAMICS TO COOLING OF COMPUTER SYSTEMS |
| 16:00 | Coffee | |
| 16:20 17:40 | Session
1
Chair: D. Blackburn |
EVALUATION OF THERMAL MEASUREMENTS |
| 16:20 | V.
Székely, M. Rencz, S. Torok, G. Farkas, Cs. Marta
Techn. Univ. of Budapest, Hungary |
ADVANCES IN THE THERMAL TESTING |
| 16:40 | V.A.
Koval1, S.Y. Yurish2
1State Univ. Lviv Polytechnica, The Ukraine 2Institute of Computer Techn., The Ukraine |
PRECISE FREQUENCY METHOD OF MEASUREMENT FOR INTEGRATED FREQUENCY-OUTPUT TEMPERATURE SENSORS |
| 17:00 | M.
Janicki, M. Zubert, A. Napieralski
Techn. Univ.of Lódz, Poland |
APPLICATION OF INVERSE HEAT CONDUCTION PROBLEM SOLUTION WITH ERROR CORRECTION TO ESTIMATION OF IC TEMPERATURE |
| 17:20 | Z.
Suszynski
Techn. Univ. of Koszalin, Poland |
PHOTOACOUSTIC EXAMINATION OF ADHESION IN LAYERED STRUCTURES |
| 17:40 | Coffee | |
| 18:00
19:20 |
Poster
Session 1
Chair: M. Rencz |
|
| K.O. Petrosjanc,
N.I. Rybov
Moscow Univ. of Electr. and Mathematics, Russia |
THERMAL RESISTANCE AND CAPACITANCES DETERMINATION FOR ELECTRO-THERMAL CIRCUIT SIMULATION WITH SPICE | |
| W. Wójciak,
A. Napieralski, G. Jablonski, T. Poêniak
Techn. Univ. of Lódz, Poland |
THERMAL BENCHMARK INTEGRATED CIRCUIT IN BiCMOS TECHNOLOGY | |
| F. Shiwei, X.
Xuesong, L. Changzhi
Beijing Polytechnic Univ., PR China |
THE NOVEL TEHCHNIQUE OF THERMAL MEASUREMENT FOR SEMICONDUCTOR DEVICE BY ELECTRICAL METHOD | |
| N.M. Ravindra1,
O.H. Gokce1, F.M. Tong1, S. Abedrabbo1,
V. Rajasekhar1, A. Patel1, G. Williamson2,
W. Maszara2, A. Nanda2, T. Speranza2
1New Jersey Inst. of Techno., Newark, USA 2SEMATECH, Austin, USA |
TEMPERATURE AND WAVELENGTH DEPENDENT EMISSIVITY OF SIMOX | |
| Z. Suszynski
Techn. Univ. of Koszalin, Poland |
THE MEASUREMENT METHOD OF THE OPTICALLY NON-OPAQUE MATERIALS THERMAL PARAMETERS | |
| I. Stoian, P.
Ungureanu, L. Cipcigan, C. Buduru
IPA CLUJ, Cluj-Napoca, Romania |
SYSTEM FOR TEMPERATURE MAPPING AND EVALUATION OF THE ENERGIZED HYBRID ICs AND IMICROPROCESSORS | |
| V. Székely,
Cs. Marta, M. Rencz, G. Vegh, Zs. Benedek, S. Torok
Techn. Univ. of Budapest, Hungary |
THERMAL BENCHMARK CIRCUIT | |
| A.G. Madera
Russia Academy of Science, Moscow, Russia |
ANALYSIS AND COMPUTATION OF ACTUAL TEMPERATURE FIELDS IN ICs AND ELECTRON MODULES | |
| W. Pawelski, A.
Napieralski, M. Grecki
Techn. Univ. of Lódz, Poland |
THE IGBT CIRCUIT-ORIENTED ISOTHERMIC MODEL | |
| M. Wiklund
Lund Univ., Sweden |
CALCULATION OF REAL POWER FLOW FROM A MOS TRANSISTOR MODEL | |
| Z. Lisik, J. Podgórski,
M. Kaluza, M. Kopec
Techn. Univ. of Lódz, Poland |
3-D SIMULATOR OF HEAT TRANSFER IN SEMICONDUCTORS DEVICES |
|
| V.A. Koval, D.V.
Fedasyuk, I.Y. Kazymyra, M.B. Blyzniuk
State Univ. Lviv Polytechnic, The Ukraine |
PROVIDING OF ELECTRO-THERMAL COMPATIBILITY OF HYBRID MICROCIRCUITS IN CAD ENVIRONMENT | |
| J. Akhtar
CEERI, Pilani, India |
A QUANTITATIVE STUDY FOR OPTIMISATION OF DISCRETISING AND OVER-RELAXATION PARAMETERS IN THE FINITE-DIFFERENCE SOLUTION OF TRANSIENT HEAT FLOW EQUATION | |
| E. Lavitska
State Univ. Lviv Polytechnic, The Ukraine |
TEMPERATURE-DEPENDENT STRAIN OF SEMICONDUCTOR ELEMENTS AND ITS TECHNICAL APPLICATIONS | |
| J. Coughlan, S.
Foley, A. Mathewson
NMRC, Cork, Ireland |
THE DISTRIBUTION OF STRESS IN TUNGSTEN-FILLED VIA STRUCTURES - INVESTIGATIONS USING FINITE ELEMENT ANALYSIS | |
| A. Druzhinin,
E. Lavitska, I. Maryamova, Y. Pankov, V. Voronin
State Univ. Lviv Polytechnic, The Ukraine |
INFLUENCE OF THERMAL STRESSES ON TEMPERATURE-DEPENDENT CHARACTERISTICS OF SEMICONDUCTOR FILM RESISTORS | |
| 19:30 | Reception | |
Monday 22nd September | ||
| 08:40
11:00 |
Session
2
Chair: J. Parry |
THERMAL AND ELECTRO-THERMAL MODELLING AND SIMULATION |
| 8:40 | P.E. Raad1,
J.S. Wilson2, D.C. Price2
1Southern Methodist Univ., Dallas, USA 2Texas Instruments, Dallas, USA |
ADAPTIVE MODELING OF THE TRANSIENTS OF SUBMICRON INTEGRATED CIRCUITS |
| 9:00 | V.Székely
Techn. Univ. of Budapest, Hungary |
SUNRED: A NEW THERMAL SIMULATOR AND TYPICAL APPLICATIONS |
| 9:20 | F. Christiaens1,
B. Vandevelde1, E. Beyne1, J. Roggen1,
R. Mertens1, J. Van Puymbroeck2, M. Heerman2,
J. Berghmans3
1IMEC vzw, Leuven, Belgium 2Siemens LPT, Oostkamp, Belgium 3KU Leuven, Belgium |
THERMAL MODELLING OF THE POLYMER STUD GRID ARRAY (PSGATM) STEADY-STATE ANALYSIS |
| 9:40 | T. Veijola, L.
Costa, M. Valtonen
Helsinki Univ. of Techn., Finland |
AN IMPLEMENTATION OF ELECTROTHERMAL COMPONENT MODELS IN A GENERAL PURPOSE CIRCUIT SIMULATION PROGRAM |
| 10:00 | S. Nooshabadi1,
G.S. Visweswran2, D. Nagchoudhuri2, K. Eshraghian3
1Northern Territory Univ., Australia 2India Institute of Techn. - N.Delhi, India 3Edith Cowan Univ., Australia |
MODELLING OF THE MOS TRANSISTOR WITH SPATIALLY NON-UNIFORM TEMPERATURE PROFILE |
| 10:20 | S. Rzepka1,
K. Banerjee2, C. Hu2
1Techn. Univ. of Dresden, Germany 2 Univ. of California, Berkeley, USA |
CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE ELEMENT SIMULATION |
| 10:40 | D. de Cogan
Univ. of East Anglia, United Kingdom |
PROPAGATION ANALYSIS FOR THERMAL MODELLING |
| 11:00 | Coffee | |
| 11:20
12:20 |
Vendor presentations | |
| 12:30 | Lunch | |
| 14:00
16:00 |
Free time | |
| 16:00
17:20 |
Session
3
Chair: A. Ortega |
TEMPERATURE MAPPING |
| 16:00 |
B.C. Forget1, S. Grauby1, D. Fournier1, P. Gleyzes1, A.C. Boccara1, A.M. Mansanares2 1ESPCI, Paris, France 2DEQ-IFGW-UNICAMP, Campinas, Brazil |
50 kHz MODULATED PHOTOTHERMAL MICROSCOPIC RESOLUTION IMAGING USING A 256x256 PIXELS CAMERA COUPLED TO A MULTICHANNEL LOCK-IN DETECTION |
| 16:20 | G. Breglio1,
S. Pica2, S. Spirito1, A. Tartaglia1
1Univ. of Napoli "Federico II", Italy 2Ansaldo Trasporti, Napoli, Italy |
EXPERIMENTAL DETECTION OF TIME DEPENDENT TEMPERATURE MAPS IN POWER BIPOLAR TRANSISTORS |
| 16:40 | J.A. Batista1,
A.M. Mansanares1, E.C. da Silva1, M.B.C. Pimentel2,
N. Jannuzzi2, D. Fournier3
1Univ. Estadual de Campinas, Brazil 2Institut de Microeletrônica, Campinas, Brazil 3UPMC, Paris, France |
SUBSURFACE MICROSCOPY OF BIASED MOS-FET STRUCTURES: PHOTOTHERMAL AND ELECTROREFLECTANCE IMAGES |
| 17:00 | O. Breitenstein,
M. Langenkamp
Max-Planck Institut für Mikrostrukturphysik Halle, Germany |
LOCK-IN CONTACT THERMOGRAPHY INVESTIGATION OF LATERAL ELECTRONIC INHOMOGENEITIES IN SEMICONDUCTOR DEVICES |
| 17:20 | Coffee | |
| 18:00
19:00 |
Poster
Session 2
Chair: M. Rencz |
|
| P. Dupuy, K. Bellil,
P. Tounsi, J.M. Dorkel
LAAS, Toulouse, France |
THERMAL AND ELECTROTHERMAL SIMULATION OF INTEGRATED POWER CIRCUITS USING SMODTHERM SOFTWARE | |
| V. Székely,
M. Rencz, A. Poppe, A. Pahi, G. Hajas, L. Liptak-Fego
Techn. Univ. of Budapest, Hungary |
UNCOVERING THERMALLY INDUCED BEHAVIOR OF ANALOG AND DIGITAL CIRCUITS WITH THE SISSI SIMULATION PACKAGE | |
| M. Wiklund
Lund Univ., Sweden |
ELECTRO-THERMAL SIMULATION USING WAVEFORM RELAXATION | |
| W. Wójciak,
M. Orlikowski, M. Zubert, A. Napieralski
Techn. Univ. of Lódz, Poland |
THE DESIGN AND ELECTRO-THERMAL MODELING OF MICRODEVICES IN CMOS COMPATIBLE MEMS TECHNOLOGY | |
| D. Allal, B. Bocquet
IEMN, Lille, France |
THERMOMETRIC MICRO-SENSOR BASED ON MICROWAVE CORRELATION RADIOMETRY | |
| K. Somogyi, G.
Sáfrán
Hungarian Academy of Sciences, Budapest, Hungary |
FIRST ORDER PHASE TRANSITION FOR CRITICAL TEMPERATURE DETECTION | |
| C. S. Roumenin,
A. Ivanov, P. Nikilova
Bulgarian Academy of Sciences, Sofia, Bulgaria |
A LINEAR MICROSENSOR FOR TEMPERATURE AND MAGNETIC FIELD USING FUNCTIONAL PRINCIPLE | |
| J. Verkelis1,
Z. Bliznikas2, K. Breive2, V.Dikinis3,
R. .armaitis3
1Semiconductor Physics Institute, Vilnius, Lithuania 2Institute of Materials Science and Applied Research of Vilnius University, Lithuania 3Institute of Chemistry, Vilnius, Lithuania |
VO2THIN FILM FIXED TEMPERATURE HEAT SENSOR HAVING ACCIDENT MEMORY | |
| M.J. Marongiu1,
A. Watwe2, B. Kusha2
1MJM Engineering Co., Naperville, USA 2Fluent Inc., Evanston, USA |
STUDIES ON THE ENHANCEMENT OF MICROCHANNEL HEAT SINKS WITH MICRO-HEAT PIPES AND OTHER HIGH THERMAL CONDUCTIVTY MATERIALS | |
| A.K. Stubos
NCSR Demokritos, Attikis, Greece |
THEORETICAL EVIDENCE AND CONCEPTUAL DESIGN FOR ENHANCED COOLING OF ELECTRONIC COMPONENTS VIA BOILING IN POROUS LAYERS | |
| K. Chung
AI Technology, Inc., Princeton, USA |
COMPARATIVE THERMAL MANAGEMENT WITH THERMAL GREASES, GASKETS, AND "PHASE-CHANGE PADS" | |
| P. Dziurdzia,
P. Bratek, A. Kos
Univ. of Mining and Metallurgy, Krakow, Poland |
POWER FEEDBACK FOR TEMPERATURE CONTROL OF ICs | |
| K. Madani1,
G. deTremiolles1&2
1Univ. Paris XII/LERISS, Lieusaint, France 2IBM, Corbeil Essonnes, France |
GLOBAL PERTURBATIONS EFFECTS ANALYSIS IN A CMOS ANALOGUE IMPLEMENTATION OF SYNCHRONOUS BOLTZMANN MACHINE | |
| A. Merticaru,
N. Moldovan, M. Ilie
Institute of Microtechnology, Bucharest, Romania |
THE THERMAL MICROSHIELD OBTAINED BY ANISOTROPIC ETCHING OF SILICON WAFERS | |
| K. Somogyi
Hungarian Academy of Sciences, Budapest, Hungary |
SOME CRITICAL CONDITIONS OF THE THERMAL BREAKDOWN IN SEMICONDUCTORS | |
| F. P. Shih, T.Y.
Wu, CH.H. Chen, T.L. Sung, C.Y. Tsai
De Montfort Univ., Leicester, United Kingdom |
EFFECTS OF NONEQUILIBRIUM LO PHONONS ON THE CARRIER HEATING IN SEMICONDUCTOR QUANTUM-WELL LASERS | |
| A. Belache1,
T. Gautier1, J.C. de Jaeger2, M. Lefebvre2,
G. Salmer2
1Thomson-CSF, Elancourt, France 2IEMN, Lille, France |
ELECTRO-THERMAL INVESTIGATIONS OF GaAs MESFETs | |
| 19:00 | Banquet | |
| 20:30
22:00 |
PANEL
Moderator: T.
Williams |
THERMAL MANAGEMENT: A LONELY FIGHT OR CONCURRENT ENGINEERING ? |
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Panelists: D. Agonafer, IBM, Poughkeepsie, USA G. De Mey, University of Ghent, Belgium G. Kromann, Motorola, Austin, USA N. Sabry, Anacad/Mentor Graphics, Meylan, France T. Tarter, AMD, Sunnyvale, USA |
The panel intends to put together experts from various disciplines in connection with thermal issues like circuit design, testing, packaging, cooling, thermal management education, etc., in order to discuss to which extent the thermal issues in microelectronics may or may not be treated independently today and in the near future. | |
Tuesday 23rd September | ||
| 09:00 | Invited
talk
A. Majumdar Chair: V. Székely |
HIGH-RESOLUTION THERMAL IMAGING OF ELECTRONIC DEVICES AND INTERCONNECTS |
| 09:40 | Coffee | |
| 10:00
12:00 |
Session
4
Chair: Y. Zorian |
SENSORS AND ACTUATORS |
| 10:00 | R.A. Bianchi,
F.V. Santos, J.M. Karam, B. Courtois
TIMA, Grenoble, France |
CMOS COMPATIBLE TEMPERATURE SENSOR USING LATERAL BIPOLAR TRANSISTOR FOR VERY WIDE TEMPERATURE RANGE APPLICATIONS |
| 10:20 | U. Dillner, E.
Kessler, V. Baier, R. Güttich, J.Müller
IPHT, Jena, Germany |
THERMAL SIMULATION OF MICROMACHINED LINEAR THERMOPILE INFRARED RADIATION SENSOR ARRAYS |
| 10:40 | T. Sokoll, V.
Norkus, G. Gerlach
Techn. Univ. of Dresden, Germany |
THERMAL AND SPATIAL RESOLUTION OF PYROELECTRIC LINEAR ARRAYS |
| 11:00 | J.I. Hayasaka,
M. Kimura
Tohoku-Gakuin Univ., Miyagi, Japan |
PROPOSAL OF AN ULTRAMINIATURIZED THERMAL ANALYSER |
| 11:20 | P.R. van der Meer,
G.C.M. Meijer, M.J. Vellekoop, H.M.M. Kerkvliet
Delft Univ. of Techno., The Netherlands |
A LOW-COST TEMPERATURE-CONTROL SYSTEM FOR SURFACE ACOUSTIC WAVE GAS SENSORS USING SMART TEMPERATURE SENSORS |
| 11:40 | G. Cocorullo1&2,
F.G. Della Corte1, I. Rendina1
1CNR IRECE, Napoli, Italy 2Univ. della Calabria, Rende, Italy |
ALL-SILICON THERMO-OPTIC MICRO-SWITCHES REALIZED BY VLSI TECHNOLOGY |
| 12:15 | Lunch | |
| 14:00
15:40 |
Session
5
Chair: W. Claeys |
MEASURING THERMAL MATERIAL PARAMETERS |
| 14:00 | S. Dilhaire, T.
Phan, E. Schaub, W. Claeys
Univ. Bordeaux I, Talence, France |
THERMOMECHANICAL STUDIES OF MICROELECTRONIC INTERCONNECTS BY DIFFERENTIAL INTERFEROMETRY |
| 14:20 | B. Bonello, B.
Perrin, C. Rossignol
Univ. P. & M. Curie, Paris, France |
THERMAL PROPERTIES OF SUB-MICROMETER NANOSTRUCTURES IN THE PICOSECOND REGIME |
| 14:40 | M. Malinski, L.
Bychto
Techn. Univ. of Koszalin, Poland |
PHOTOACOUSTIC METHODS OF DETERMINATIONS OF THERMAL PARAMETERS OF ELECTRONIC MATERIALS |
| 15:00 | K. Kurabayashi,
K.E. Goodson
Stanford Univ., USA |
MEASUREMENT OF THE ANISOTROPIC THERMAL CONDUCTIVITY IN POLYMER THIN FILMS FOR LOW-DIELECTRIC-CONSTANT PASSIVATION |
| 15:20 | V.V. Luchinin,
A.V. Korlyakov
St. Petersburg Electr. Univ., Russia |
THE SILICON CARBIDE-ON-INSULATOR STRUCTURE AS A SUBJECT OF THERMAL INVESTIGATIONS |
| 15:40
16:20 |
Special
Session: DELPHI/SEED
Chair: V. Székely |
This special session is dedicated to Harvey Rosten, coordinator of the DELPHI project, who died in June this year. He will be remembered for his many contributions to the industry, and particularly his work on the compact modelling of packages |
| J. Parry, H. Rosten
Flomerics Ltd, Surrey, United Kingdom |
AN UPDATE ON THE INDUSTRIAL EVALUATION OF THE DELPHI RESULTS AND THE PERFORMANCE OF DELPHI COMPACT MODELS | |
| 16:20
16:30 |
Closing remarks | |
| Proceedings, special issues of journals | ||
| The informal proceedings of the workshop is formed by the Collection of papers presented at the 3rd Therminic Workshop (287 pages), which was distributed among the workshop participants. Limited number of copies is available for FF200 from TIMA. As follow up to the Workshop special issue of the Sensors and Actuators A Physical (Vol. A 71, no. 1-2, Nov. 1998) and a special issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, (Sept. 1998, Vol. 21, No. 3) were prepared based on contributions presented at the 3rd Workshop. These issues form the formal proceedings of the workshop. | ||
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