Revue : [REVUE355]

Titre : Elsevier Science, Microelectronics Reliability, Volume 42, Issue 8, Pages 1153-1248, August 2002.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.

Volume : 42
Issue : 8
Pages : 1153 - 1248
Date : August 2002

[1] : In the memory of Georges Charitat, Pages 1153-1154
Marise Bafleur
Lien : private/CHARITAT.pdf - | Full Text + Links | PDF (41 K)

[2] : A review of reliability prediction methods for electronic devices, Pages 1155-1162
B. Foucher, J. Boullié, B. Meslet and D. Das
Lien : private/FOUCHER1.pdf - | Full Text + Links | PDF (98 K)

  [1] :  [ART294]  B. FOUCHER, J. BOULLIE, B. MESLET, D. DAS, A review of reliability prediction methods for electronic devices, Microelectronics Reliability, Volume 42, Issues 8, pp. 115-1162.

[3] : Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing, Pages 1163-1170
Leon Lantz, Seongdeok Hwang and Michael Pecht
Lien : private/LANTZ1.pdf - | Full Text + Links | PDF (143 K)

  [1] :  [ART295]  L. LANTZ, S. HWANG, M. PECHT, Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing, Microelectronics Reliability, Volume 42, Issues 7, pp. 1163-1170.

[4] : Thermal Ta2O5¯¯alternative to SiO2 for storage capacitor application, Pages : 1171-1177
E. Atanassova and D. Spasov
Lien : vide.pdf - | Full Text + Links | PDF (569 K)

[5] : Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy, Pages 1179-1184
W. K. Fong, C. F. Zhu, B. H. Leung, C. Surya, B. Sundaravel, E. Z. Luo, J. B. Xu and I. H. Wilson
Lien : vide.pdf - | Full Text + Links | PDF (119 K)

[6] : Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature, Pages 1185-1194
Y. C. Chan and D. Y. Luk
Lien : vide.pdf - | Full Text + Links | PDF (1047 K)

[7] : Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure, Pages 1195-1204
Y. C. Chan and D. Y. Luk
Lien : vide.pdf - | Full Text + Links | PDF (657 K)

[8] : No-flow underfill flip chip assembly¯¯an experimental and modeling analysis, Pages 1205-1212
H. Lu, K. C. Hung, S. Stoyanov, C. Bailey and Y. C. Chan
Lien : vide.pdf - | Full Text + Links | PDF (521 K)

[9] : Searching for appropriate humidity accelerated migration reliability tests methods, Pages 1213-1218
P. Bojta, P. Németh and G. Harsányi
Lien : vide.pdf - | Full Text + Links | PDF (347 K)

[10] : High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package, Pages 1219-1227
Huimin Xie, Anand Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhong Zhaowei and Bryan K. A. Ngoi
Lien : vide.pdf - | Full Text + Links | PDF (369 K)

[11] : Study of the effect of reflow time and temperature on Cu¯Sn intermetallic compound layer reliability, Pages 1229-1234
Wei Huang, James M. Loman and Bülent Sener
Lien : vide.pdf - | Full Text + Links | PDF (195 K)

[12] : Testing process performance based on the yield: an application to the liquid-crystal display module, Pages 1235-1241
Jann-Pygn Chen and W. L. Pearn
Lien : vide.pdf - | Full Text + Links | PDF (192 K)

[13] : A novel simulation technique for testing analog ICs, Pages 1243-1248
M. Dhifi
Lien : vide.pdf - | Full Text + Links | PDF (129 K)

[14] : 11th International Symposium on Silicon-on-Insulator Technology and Devices, Page VII
PDF (25 K)

[15] : Calendar for forthcoming events, Pages I-V
PDF (30 K)

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