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| Timing | Event | Author | ||
|---|---|---|---|---|
| Day 1 |  | Monday March 31st | ||
| 7h30 | 60mn |  | Registration | |
| 8h30 | 10mn |  | Opening session | |
| 8h30 | 10mn |  | Conference opening | Olivier de Saint Leger, MTA, France |
| 8h40 | 2h | | Session 1: Trends in Microelectronics and Microsystems | Chair: K.Zhang, Philips, The Netherlands |
| 8h40 | 30mn | | Keynote: From Smart Card to Smart Object | Henri Boccia, Gemplus, France |
| 9h10 | 30mn | | Keynote:Market Situation, Trends and Reliability Issues of Micro-Systems as Enabler for Automotive Applications | Günter Lugert, Thomas Riepl, Siemens, Germany |
| 9h40 | 30mn | | Keynote: Needs for advanced packaging and new developments of IC process | Didier Grenier, STMicroelectronics, France |
| 10h10 | 30mn | | Keynote:Carbon nanotube applications in microelectronics | W. Hoenlein, F. Kreupl, G.S. Duesberg, A.P. Graham, M. Liebau, R. Seidel, E. Unger, Infineon, Germany |
| 10h40 | 30mn |  | Coffee break | |
| 11h10 | 1h30 | | Session 2: State of the Art in Thermal and Mechanical Simulations | Chair: L.Ernst, Technical University of Delft, The Netherlands |
| 11h10 | 30mn | | Keynote: Delamination of electronic package | Matthew Yuen, Haibo Fan, Hong Kong Univ. of Science and Technology, Hong Kong |
| 11h40 | 30mn | | Keynote:Computer-aided engineering of electro-thermal MST devices: moving from device to system simulation | Jan G. Korvink, Evgenii B. Rudnyi, University of Freiburg, Germany |
| 12h10 | 30mn | | Keynote: Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements | Peter Rogers, Electronics Thermal Management, Ltd., Ireland |
| 12h40 | 10mn | | Welcome address | Michel Salord, VP Council for Economic Development of Aix-en-Provence County |
| 12h50 | 90mn |  | Lunch | |
| 14h20 | 1h30 |  | Parallel sessions | |
| 14h20 | 1h30 | | Parallel Session 3: Adhesives, Encapsulation, and Underfilll | Chair: B.Vandevelde, IMEC, Belgium |
| 14h20 | 30mn | | Keynote: Development of the Green Plastic Encapsulation for High Density Wire Bonded Packages | T.Y. Lin , C.M.Fang, Y.F.Yao, K.H.Chua, Agere Systems Singapore Pte Ltd., Singapore |
| 14h50 | 20mn | | Thermal-mechanical properties of an electrically conductive adhesive | M.H.H. Meuwissen, H.L.A.H. Steijvers, M. van den Nieuwenhof, TNO Institute of Industrial Technology, The Netherlands |
| 15h10 | 20mn | | Micromechanical modeling of stress evolution induced during cure in a particle filled electronic packaging polymer | D.G. Yang , K.M.B. Jansen, L.G. Wang, L.J. Ernst, Delft University of Technology G.Q. Zhang, H.J.L. Bressers, Philips, The Netherlands |
| 15h30 | 20mn | | Reliability Investigations of Flip Chip Package with Porous Underfill | K.-C. Liao, H. H. Tsai, Mechanical Engineering, Mingchi Institute of Technology, Taiwan |
| 14h20 | 1h30 | | Parallel Session 4: Thermal Behavior Modeling | Chair: P.Rodgers, Electronics Thermal Management, Ireland |
| 14h20 | 30mn | | Keynote: Thermal Behavior of Stacked System-in-Package | Jani Valtanen, Pekka Heino, and Eero Ristolainen, Tampere University of Technology, Finland |
| 14h50 | 20mn | | Modeling the Assembly and Performance of Optoelectronic Packages | D.Gwyer, C. Bailey, K. Pericleous, University of Greenwich, UK
D. Philpott, P. Misselbrook, Celestica, UK |
| 15h10 | 20mn | | Thermal Management of Joule-heating Microreactor using Modelling Tools | Nicolás Cordero, Jonathan West, Helen Berney, NMRC, University College, Ireland |
| 15h30 | 20mn | | Study of semiconductor surfaces in the radiant-heat transfer systems | V.I.Rudakov, V.V. Ovcharov, V.P.Prigara, Institute of Microelectronics and Informatics, Russian Academy of Sciences, Russia |
| 15h50 | 40mn | | Coffee break | |
| 16h30 | 1h30 | | Parallel sessions 5 and 6 | |
| 16h30 | 1h30 | | Parallel Session 5: Reliability of Solder Interconnection | Chair: M.Meuwissen, TNO, The Netherlands |
| 16h30 | 30mn | | Keynote: Thermo Mechanical Solder Joint Fatigue Under Mobile Phone Usage Conditions | Pirkka Myllykoski, Nokia, Finland |
| 17h00 | 20mn | | Microstructure evolution of tin-lead solder | R.L.J.M. Ubachs, P.J.G. Schreurs, and M.G.D. Geers, Eindhoven University of Technology, The Netherlands |
| 17h20 | 20mn | | Quantitative microscopy of microstructural evolution in eutectic solders subjected to static thermal load | M.A. Matin, W.P.Vellinga, M.G.D.Geers, Eindhoven University of Technology, The Netherlands |
| 17h40 | 20mn | | FE Modeling of a shear test: Correlation with experiments | M. Gonzalez, B. Vandevelde, R. Van Hoof and E. Beyne, IMEC, Belgium |
| 16h30 | 1h30 | | Parallel Session 6: Thermal & Mechanical problems in Advanced Packaging | Chair: H.Pape, Infineon Technologies, Germany |
| 16h30 | 30mn | | Keynote: Mechanical, Thermal and Electrical Issues in System-in-a-Package on Low-Cost Liquid Crystal Polymer Substrate | Johan Liu, Liu Chen, Gang Zou, Chalmers University of Technology C/O IVF, Sweden, Jorma Kivilahti, Helsinki University of Technology, Finland |
| 17h00 | 20mn | | Reliability Prediction of Exposed Pad Type Semiconductor Packages | Torsten Hauck, Tina Bohm, Motorola GmbH, Germany |
| 17h20 | 20mn | | Reliability Analysis of a New Type of Optical Fiber Array Module for Transceivers | Hsiao-Tung Ku and Kuo-Ning Chiang, National Tsing Hua University, Taiwan |
| 17h40 | 20mn | | Feasibility Study of a Thermal Packaging for Fiber Bragg Gratings by Invar Effect Substrate | H.H., Tsai, K.C. Liao, Mingchi Institute of Technology, Taiwan |
| 18h00 |  | End of technical session day 1 | ||
| 18h10 |  | EuroSimE Committee meeting | ||
| 19h45 |  | Gala dinner | ||
| Day 2 | | Tuesday April 1st | ||
| 8h00 | 30mn | | Registration | |
| 8h30 | 1h30 | | Parallel sessions 7 and 8 | |
| 8h30 | 1h30 | | Parallel Session 7: Advanced Packaging and MEMS Designing | Chair: S.Marco, University of Barcelona, Spain |
| 8h30 | 30mn | | Keynote: Requirements in Advanced Packaging Curriculum | Guna Selvaduray, Joseph F. Becker and H Anthony Chan, San Jose State Univ. ,USA |
| 9h00 | 20mn | | Nonlinear Reduced Modeling Of a Damped Dual-axis Accelerometer | Eskild R. Westby, Norwegian University of Science and Technology, Norway |
| 9h20 | 20mn | | FEA Simulation of Package Stress in Transfer Molded MEMS Pressure Sensors | Rudolf Krondorfer, Timothy C. Lommasson, SensoNor asa, Norway Yeong Kim, Samsung Techwin, Korea |
| 9h40 | 20mn | | Characterisation of P and N Type Silicon Piezoresistive Strain Gauges | D. O’Mahoney, O. Slattery, E. Sheehan, Finbarr Waldron, National Microelectronics Research Centre, University College Cork, Ireland |
| 8h30 | 1h30 | | Parallel Session 8: Thermal Modeling | Chair: X.Fan, Philips, USA |
| 8h30 | 30mn | | Keynote: Component Modeling Methodology in Consumer Electronic Product Development | Geneviève Martin,Wendy Luiten, Philips, The Netherlands |
| 9h00 | 20mn | | An approach to a numerical simulation of thermal contact problems in electronic packages | K. Friedel; A. Wymyslowski, Wroclaw University of Technology, Poland |
| 9h20 | 20mn | | A model based optimization of a line shaped Laval nozzle for Micro Abrasive Air Jetting | A. Holtsmark, M. Achtsnick, A. M. Hoogstrate, B. Karpuschewski, A. Beukers, Delft University of Technology, The Netherlands |
| 9h40 | 20mn | | Investigations of the thermal properties of AII-BVI mixed crystals with the piezoelectric phase spectra method | M. Malinski, Technical University of Koszalin J. Zakrzewski, H. Meczynska, Nicolaus Copernicus University, Poland |
| 10h00 | 30mn | | Coffee break | |
| 10h30 | 2h10 | | Parallel sessions 9 and 10 | |
| 10h30 | 2h10 | | Parallel Session 9: Designing for Endurance and Reliability | Chair: A.Wymyslowski, Wroclaw University, Poland |
| 10h30 | 30mn | | Keynote: Design Analysis and Optimization of Wirebond Stacked Die BGA Packages for Improved Board Level Solder Joint Reliability | Tong Yan Teea,, Hun Shen Nga, Xavier Baratona, STMicroelectronics Singapore Zhaowei Zhong, Nanyang Technological University, Singapore |
| 11h00 | 20mn | | Optimization of the Reliability of a BGA Package by Finite-Element-Simulation | Anton Legen, Manuel Carmona, Jens Pohl, Jochen Thomas, Infineon Technologies AG, Germany |
| 11h20 | 20mn | | Response Surface Methodology for Enhancing Theoretical Models: Application to Warpage Prediction of CSP BGAs | Eric Egan, Gerard Kelly, Tom O’Donovan, Peter Kennedy, National University of Ireland Gerard Kelly, Cork Institute of Technology, Ireland |
| 11h40 | 20mn | | Solution and Test of a Numerical Model Describing Lithium Evolution in Secondary Batteries | F. Ternay, A. Laurent, S. Martnet, CEA/GRENOBLE, DRT/DTEN/SCSE, France |
| 12h00 | 20mn | | Fatigue Damage Modeling in Solder Joints: a cohesive zone approach | Adnan Abdul-Baqi, Piet J.G. Schreurs, Marc G.D. Geers, Eindhoven University of Technology, The Netherlands |
| 12h20 | 20mn | | The reliability study of underfill Flip Chip in Micro-electronic Packaging | Xiaosong Ma, J.J.Chen, D.G.Yang, Xi’an Univ. of Electronic Technology and Guilin Univ. of Electronic Technology |
| 10h30 | 2h10 | | Parallel Session 10: Thermal Performance | Chair: N.Cordero, Ireland |
| 10h30 | 30mn | | Keynote: Board Via Effect on Thermal Performance of a Leadless Package | Heinz Pape, Kay Schille, Rudolf Kutscherauer, Infineon Technologies AG, Germany |
| 11h00 | 20mn | | Wafer Scale Power Transistor Package: Electro-Thermal Modeling and Validation | A.W.J.P. den Boer, M.A.J. van Gils, G.M. Janssen, Philips, The Netherlands |
| 11h20 | 20mn | | Comparative Study of Power Module Technologies by means of Thermal Simulation Tools | Peter Hansen, Flemming Nielsen, Hans S. Nielsen, John Jacobsen, Grundfos A/S, Denmark |
| 11h40 | 20mn | | An Investigation of Thermal Enhancement of MPM BGA Package | Abe-JM Yang, Cary Yang, Carol Liang, Jeng Yung Lai, Yu-Po Wang, CS Hsiao, Siliconware Precision Industries Co., Ltd., Taiwan |
| 12h00 | 20mn | | Packaging simulation in gas flow sensors | N.Sabaté, I.Gràcia, J.Berganzo, C.Can, Centre Nacional de Microelectrònica, CNM-CSIC, Spain |
| 12h40 | 90mn | | Lunch | |
| 14h10 | 2h10 | | Parallel Sessions 11 and 12 | |
| 14h10 | 2h10 | | Parallel Session 11: MEMS, Sensors and Actuators | Chair: I. de Wolf, IMEC, Belgium |
| 14h10 | 30mn | | Keynote: Design Study for Stacked MEMS | Jan Eite Bullema, Marcel Meuwissen, Erik Veninga, TNO, The Netherlands |
| 14h40 | 20mn | | Thermal FEM simulation of ultra-miniaturised wall shear sensors | Delphine Meunier, Jumana Boussey, CNRS, Institut de Microélectronique, Electromagnétisme et Photonique, IMEP, France |
| 15h00 | 20mn | | Design, analysis and validation of vertical probing technology | Chang-An Yuan, Hsing-Chih Liu, Ming-Hung Sun and Kou-Ning Chiang, National Tsing Hua University, Taiwan |
| 15h20 | 20mn | | Development of a Compact Thermal Model for a Micropyrotechnic Actuator | M. Salleras, J. Palacín, M. Puig, J. Samitier, S. Marco, Universitat de Barcelona, Spain |
| 15h40 | 20mn | | Experimental Verification of the FE model of a Thick-film Ceramic Pressure Sensor | Marina Santo Zarnik, Darko Belavic, HIPOT-R&D / Jozef Stefan Institute, Slovenia K.P. Friedel; A. Wymyslowski, Wroclaw University of Technology, Poland |
| 16h00 | 20mn | | Modeling of Pyroelectric Sensor Arrays | Günter Milde, Jörg Drescher, Gerald Gerlach, Herbert Balke, Hans-Achim Bahr, TU Dresden, Germany |
| 14h10 | 2h10 | | Parallel Session 12: IC Process Reliability Modeling and Characterization | Chair: B.Schwarz, Siemens, Germany |
| 14h10 | 30mn | | Keynote: Prediction of Crack Growth of IC Passivation Layer | G.Q. Zhang, M.A.J. van Gils, R.B.R. Silfhout, W.D. van Driel, Philips, The Netherlands Y.T. He, L.J. Ernst, Delft University of Technology, the Netherlands |
| 14h40 | 20mn | | The Impact of Wafer-Level Stress on Package Warpage and Die Attach Stress | Eric Egan, Anne-Marie Kelleher, Tom O’Donovan, Peter Kennedy, National University of Ireland Gerard Kelly, Cork Institute of Technology, Ireland |
| 15h00 | 20mn | | Prediction of interfacial delamination failures of a stacked IC structure using combined experimental and simulation methods | Zhang G.Q, Van Driel W., Van Gils M., Van Silfhout R., Philips, The Netherlands Liu C.J., Ernst L.J., Delft University of Technology, The Netherlands |
| 15h20 | 20mn | | Mechanical FEM simulation of bonding process on Cu low-K wafers | Dominiek Degryse, Bart Vandevelde and Eric Beyne, IMEC, Belgium |
| 15h40 | 20mn | | Effect of Delamination of IC/Compound Interface on Passivation Cracking | R.B.R van Silfhout, J.D. Roustant, W.D. van Driel, Y. Li, G.Q. Zhang, M.A.J. van Gils, Philips, The Netherlands, D.G. Yang, Delft University of Technology |
| 16h00 | 20mn | | Prediction of Thermo-Mechanical Integrity of Wafer Backend Processes | G.Q. Zhang, J. den Toonder, J. Beijer, Philips, The Netherlands R.J.O.M. Hoofman, Philips Belgium V. Gonda, , L.J. Ernst, Delft University of Technology, The Netherlands |
| 16h20 | 30mn | | Coffee break | |
| 16h50 | 1h40 | | Special Exhibitor Session | Chair: W.van Driel, Philips Semiconductors, The Netherlands |
| 16h50 | 15mn | | Recent Advances of Abaqus Capabilities for MicroElectonic Simulations | Frans Peeters, Abaqus |
| 17h05 | 15mn | | Fast prediction of thermo-mechanical stresses in electronic components under actual operating conditions, using the FLO/STRESS software | Simon Wrigglesworth, Flomerics |
| 17h20 | 15mn | | Process Integration & Design Optimization using OPTIMUS | Hans Wynendaele, Joost Van de Peer, LMS International |
| 17h35 | 15mn | | Thermal Simulation of Complex Electronic Equipment | Thomas Willkommen, Fluent |
| 17h50 | 15mn | | TBD | Bob Gilliver, Ansys |
| 18h05 | | End of technical sessions day 2 | ||
| 18h05 |  | Cocktail party | ||
| Day 3 | | Wednesday April 2nd | ||
| 8h30 | 1h30 | | Session 13:Characterization and Modeling of Materials and Reliability | Chair: R.Dudek, Fraunhofer-IZM, Germany |
| 8h30 | 30mn | | Keynote: New Failure Analysis Methods in Microelectronics | Ingrid de Wolf, IMEC, Belgium |
| 9h00 | 30mn | | Keynote: Simulation of microstructure evolution in metallic alloys | Markus Apel, B. Böttger, G.J. Schmitz, Univ. of Aachen, Germany |
| 9h30 | 30mn | | Keynote: Investigations on Low Cycle Fatigue of Electrodeposited Thin Copper and Nickel Films | Rainer Dudek, Hans Walter, and Bernd Michel, Fraunhofer-IZM, Germany Jörg Zapf, Siemens AG, Germany |
| 10h00 | 40mn | | Coffee break | |
| 10h40 | 1h50 | | Parallel sessions 14 and 15 | |
| 10h40 | 1h50 | | Parallel Session 14: Simulation and Optimisation in Microelectronics | Chair: D.Andersson, IVF, Sweden |
| 10h40 | 30mn | | Keynote: Optimization and Finite Element Analysis for Reliable Electronic Packaging | S. Stoyanov, C. Bailey, University of Greenwich, UK |
| 11h10 | 20mn | | Numerical Simulation and Optimization of Capacitive Transducers | H. Landes, R. Lerch, M. Kaltenbacher, R. Peipp, University of Erlangen-Nuremberg F. Vogel, inuTech GmbH, Nuremberg, Germany |
| 11h30 | 20mn | | Comparison of Lifetime Predictions with 3D Finite Element Models of a High Density Flip Chip without Underfill on LTCC | M. Spraul, W. Nüchter, A. Möller, Robert Bosch Gmbh, Germany A. Schubert, B. Michel, Fraunhofer IZM, Germany |
| 11h50 | 20mn | | The Reliability Analysis and Structure Design for High Density Flip Chip BGA Packaging | Chih-Tang Peng, Chang-Ming Liu, Kuo-Ning Chiang, National Tsing Hua University, Taiwan |
| 12h10 | 20mn | | Influence of material combinations on delamination failures in a cavity down TBGA package | W.D. van Driel, G.Q. Zhang, Philips, The Netherlands A.Y.L. Chang, Philips Semiconductors Kaohsiung, Taiwan G. Wisse, L.J. Ernst, Delft University of Technology, The Netherlands |
| 10h40 | 1h50 | | Parallel Session 15: Designing towards Environmental Demands | Chair: T.Reinikainen, Nokia Mobile Phones, USA |
| 10h40 | 30mn | | Keynote: The state of the art of lead-free solders | Sabine Knott and Adolf Mikula,, |
| 11h10 | 20mn | | Microstructure and Creep Behaviour of eutectic SnAg and SnAgCu Solders | S. Wiese, K.J. Wolter, Technische Universität Dresden, Germany |
| 11h30 | 20mn | | Microstructural Change of Lead-Containing and Lead Free Solders: Experiments and Computer Simulations | H.-J. Albrecht, D.S. Brodie, Siemens AG Berlin, Germany A.J. Gunn, Heriot-Watt University, UK W.H. Müller, Technische Universität Berlin, Germany |
| 11h50 | 20mn | | Tensile and Fatigue Isothermal Properties of Copper Joints with Sn63-Pb37, Sn62-Pb36-Ag2 and Sn42-Bi58 Alloys | E. M. Grigoletto, A. Damasco, I. Ferreira, State University of Campinas, Brasil |
| 12h10 | 20mn | | Parametric study on Flip Chip package with lead-free solder joints by using the probabilistic design approach | J.S. Liang, D.G. Yang, Q.Y. Li, Guilin University of Electronic Technology, China L.J. Ernst, Delft University of Technology, The Netherlands G. Q. Zhang, Philips, The Netherlands |
| 12h30 | 90mn | | Lunch | |
| 14h00 | 2h | | Session 16: New Techniques in Modeling and Characterization | Chair: M.Yuen, University of Science and Technology, Hong-Kong |
| 14h00 | 30mn | | Keynote: Material Response Prediction and Understanding Through the use of Molecular Modeling | Nancy Iwamoto, Honeywell, USA |
| 14h30 | 30mn | | Keynote: Micro-Digital Image Speckle Correlation (u-DiSC) System and its Applications to Microelectronics Packages | Xunqing Shi, Singapore Institute of Manufacturing Technology, Singapore |
| 15h00 | 30mn | | Keynote: Understanding Morphology Changes in Solders | Wolfgang H. Mueller, Technische Universitat Berlin, Germany |
| 15h30 | 30mn | | Keynote: A Simulation-Based Multi-Objective Design Optimization of Electronic Packaging under Thermal Cycling and Bend Load | Leon Xu, Wei Ren, and Tommi Reinikainen, Nokia Mobile Phones, USA |
| 16h00 | 10mn |  | Conference closure | G.Q. Zhang, Philips, The Netherlands |
| 16h10 | | Coffee, drinks | ||
| See you at EuroSimE 2004 ! | ||||
