T04 Tutorial on integrated passive components
Eberhard Waffenschmidt, Philips
Research Aachen
J.A.Ferreira, Delft university of Technology
P. Mc Closkey, PEI
Half day (1 p.m. to 4 p.m.)
Location: Semriach
including sightseeing: Lur-Grotte or Stübing (old farming
houses open air museum)
In order to improve size, cost and other problems of power circuits for high volume applications, a major issue are passive (electromagnetic) components like capacitors and magnetic devices:
Current technologies are approaching a level, where only minor progress in miniaturisation, performance and cost reduction is possible. Compared to microelectronic semiconductor circuits no remarkable development has been appeared during the last decades. Therefore, new concepts to build and construct power converters are necessary.
Especially the integration of passive components promises a quantum step forward. This makes a new way of thinking and describing of a electronic circuit necessary. In the first part of the tutorial J.A. Ferreira will give an introduction of new ways to understand integrated structures.
While much progress has been made during the last few decades on monolithic and hybrid integration of active component, the packaging and integration of the passive components received little attention. One of the main challenges lying ahead for power electronics is to supplement the silicon integration with electromagnetic and thermal integration in the switchmode circuits. Innovation in the integration and packaging of power converters is more than just building them differently. It also changes the way converters are manufactured, and eventually will also change the way that the power electronics industry is organized. In the first part of the tutorial J.A. Ferreira will discuss various issues and concepts regarding passive component integration.
Passive integration makes new manufacturing processes necessary. Especially promising from a cost point of view are processes which are compatible to existing printed circuit board (PCB) technologies. Currently, a trend to integrate magnetics into the PCB can be observed in power electronics. This trend would be extended, integrating also capacitors into the "PCB" using highly capacitive layers. Then, the circuit will be constructed from layers of different, structured materials instead of discrete components. E. Waffenschmidt will give an overview of existing technologies, about their use for power converter and about the needs for further development.
To apply these technologies in a fast development environment, it must be possible to understand and design integrated devices. Therefore E. Waffenschmidt will give an introduction about the function of integrated L-C-T devices. Besides the basic function he will explain the influence of parasitic elements and will discuss power losses in such a structures. The properties of these integrated devices will be compared to conventional, discrete solutions.
For more advanced solutions, new materials and processes are under investigation by several research teams. This includes developments in several technologies, with PCB, thin film and co-fired technologies offering promising solutions for integrated magnetic components. The integration of capacitors has also been achieved within each of these technologies. While the power ranges addressed are typically quite low (at less than 5 W), work is ongoing to extend the capabilities for higher power levels. P. McCloskey will demonstrate the latest development in the research community. He will present the results of a review of the capabilities of each technology in terms of material properties, process limitations and current developments. The application of the technologies to providing integrated converter solutions for different power levels will also be illustrated and compared.
It addresses engineers in development and pre-development who want to design advanced circuits for power supply circuits. It furthermore addresses colleagues who want to get an overview of this technology for future power systems to steer the development of their company or research institution.
13:00 h: The future of integration of packaging, J.A. Ferreira
13:45 h: Design of L-C-T devices, E. Waffenschmidt
14:15 h: Coffe break
14:30 h: Embedded passive components: Component integration into printed circuit boards, E. Waffenschmidt
15:00 h: Integrated passives technologies: research in materials and process developments, P. McCloskey
15:45 h: Final discussion
16:00 h: End
Dr. Eberhard Waffenschmidt
Philips GmbH Forschungslaboratorien
Weißhausstr.2
D-52066 Aachen
Tel.: xx49 241 6003 329
Fax.: xx49 241 6003 442
E-Mail.: eberhard.waffenschmidt@philips.com
He studied Electrical Engineering at the RWTH-Aachen (Technical University Aachen). There he received his PhD degree in 1995 in the field of passive microelectronic components made of high temperature superconductors. Since then he is working for the Philips Research Laboratory. It is located in Aachen, Germany, where he also lives. Since three years he is involved in projects with power converters for consumer applications with integrated passive components and L-C-T elements.
Prof. J.A. (Braham) Ferreira,
Electrical Power Processing Group, ITS Faculty
Delft University of Technology, Electrical Power Processing
4 Mekelweg
2628 CD Delft
Tel. 0031 15 278 6220
Fax. 0031 15 278 2968
E-mail: J.A.
Ferreira@ITS.TUDelft.NL
Jan Abraham Ferreira was born in Pretoria, South Africa, and received the B.Sc.Eng.(cum laude), M.Sc..Eng.(cum laude), and Ph.D. degrees in Electrical Engineering from the Rand Afrikaans University, Johannesburg, South Africa, in 1980, 1982, and 1988, respectively.
In 1981 he was with the Institute of Power Electronics and Electric Drives, Technical University of Aachen, and worked in industry at ESD(Pty) Ltd from 1982-1985. From 1986 until 1997 he was at the Faculty of Engineering, Rand Afrikaans University, where he held the Carl and Emily Fuchs Chair of Power Electronics. Since 1998 he is professor at the ITS Faculty of the Delft University of Technology in The Netherlands
Prof. Ferreira is currently the transactions review chairman of the IEEE IAS Power Electronic Devices and Components committee, chairman of the IEEE Joint IAS/PELS Benelux chapter and chairman of the CIGRE SC14 national committee of the Netherlands. He is also member of the IEEE PESC Adcom, and member of the executive committee of the EPE Society.
Paul McCloskey
PEI Technologies,
National Microelectronics Research Centre,
University College,
Lee Maltings,Prospect Row,
Cork,Ireland.
Tel : 00 353 21 904309
Fax: 00 333 21 270271
E- mail: pmcclosk@nmrc.ucc.ie
For the past 3 years Paul McCloskey has been the
Manager of the PEI Technologies centre at the NMRC. This research
group specialises in "Integrated Magnetics" and
"Power Electronic Packaging". Paul McCloskey graduated
with a BSc in Chemical Engineering from Queens University Belfast
in 1981. He also holds an MSc in Energy Studies obtained in 1984
and an MSc in Microelectronics obtained in 1991, both from the
University of Ulster. Prior to his appointment at PEI
Technologies he worked for 14 years in the manufacture of passive
devices at AVX Ltd and Bourns Electronics.
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