Recherche sur l'auteur "Eric WOIRGARD", juillet 2004.
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Titre : Recherche sur l'auteur Eric WOIRGARD, juillet 2004.

Cité dans : [DIV096]  Recherches bibliographiques diverses, septembre 2016.
Cité dans : [DATA147] IXL, Laboratoire IXL, Université de Bordeaux, Talence, France, http://www.ixl.u-bordeaux.fr

Date : juillet 2004

Vers : Recherche STN du mercredi 7 juillet 2004


Recherche STN du mercredi 7 juillet 2004

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Question : author: eric woirgard
Réponses : 3 réponses Dans la banque de données COMPENDEX
Réponses : 16 réponses Dans la banque de données INSPEC

Titres dans la banque de données COMPENDEX
1 : A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures.
2 : Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.
3 : Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode.

Titres dans la banque de données INSPEC
4 : 3D FEM modelling of an electro-optical micro-shutter.
5 : A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures.
6 : IGBT power modules thermal characterization: what is the optimum between a low current-high voltage or a high current-low voltage test condition for the same electrical power?.
7 : Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.
8 : Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode.
9 : Evaluation of lead-free soldering for automotive applications.
10 : Reliability study of the assembly of a large BGA on a build up board using thermo-mechanical simulations.
11 : Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200 V trench and new planar PT-IGBTs.
12 : Thermal fatigue resistance evaluation of solder joints in IGBT power modules for traction applications.
13 : High power IGBT modules: thermal fatigue resistance evaluation of the solder joints.
14 : Extensive fatigue investigation of solder joints in IGBT high power modules.
15 : Hybrid power modules using a metal matrix composite baseplate: An evaluation.
16 : Evaluation of the creep of the Sn62Pb36Ag2 solder alloy by the measurement of the stresses in a silicon die.
17 : Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods.
18 : Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions.
19 : Thermal simulation of hybrid power assemblies.

  [1] :  [ART548]  S. AZZOPARDI, J.-M. VINASSA, E. WOIRGARD, C. ZARDINI, O. BRIAT, A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures, IEEE Transactions on Power Electronics, Vol. 19, No. 1, January 2004, pp. 231-241.
  [2] :  [PAP158]  -------
  [3] :  [PAP158]  -------
  [4] :  [PAP158]  -------
  [5] :  [ART548]  S. AZZOPARDI, J.-M. VINASSA, E. WOIRGARD, C. ZARDINI, O. BRIAT, A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures, IEEE Transactions on Power Electronics, Vol. 19, No. 1, January 2004, pp. 231-241.
  [6] :  [ART437]  S. AZZOPARDI, E. WOIRGARD, J.-M. VINASSA, O. BRIAT, C. ZARDINI, IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?, Microel
  [7] :  [ART439]  A. GUEDON, E. WOIRGARD, C. ZARDINI, G. SIMON, Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant, Microelectronics Reliability, Volume 43, Issues 9-11, September-November
  [8] :  [PAP158]  -------
  [9] :  [ART331]  A. GUEDON, E. WOIRGARD, C. ZARDINI, Evaluation of lead - free soldering for automotive applications, Microelectronics Reliability, Volume 42, Issues 9-11, September-November 2002, pp. 1555-1558.
 [10] :  [ART569]  P. GUILBAULT, E. WOIRGARD, C. ZARDINI, D. LAMBERT, Reliability study of the assembly of a large BGA on a build up board using thermo-mechanical simulations, Microelectronics Reliability, Sept.-Nov. 2002, Vol.42, No. 9-11, pp. 1529-1533.
 [11] :  [ART557]  S. AZZOPARDI, A. KAWAMURA, H. IWAMOTO, O. BRIAT, J.M. VINASSA, E. WOIRGARD, C. ZARDINI, Local lifetime control IGBT structures : Turn-off performances comparison for hard- and soft-switching between 1200V trench PT- and new planar PT-IGBTs, Microelectro
 [12] :  [PAP475]  J.-M. THEBAUD, E. WOIRGARD, C. ZARDINI, K.-H. SOMMER, Thermal Fatigue Resistance Evaluation of Solder Joints in IGBT Power Modules for Traction Applications, PESC'2000.
 [13] :  [ART198]  J.-M. THEBAUD, E. WOIRGARD, C. ZARDINI, K.-H. SOMMER, High power IGBT modules: thermal fatigue resistance evaluation of the solder joints, 2000.
 [14] :  [PAP477]  J.-M. THEBAUD, E. WOIRGARD, C. ZARDINI, K.-H. SOMMER, Extensive Fatigue Investigation of Solder Joints in IGBT High Power Module, ECTC'2000.
 [15] :  [PAP158]  -------
 [16] :  [PAP224]  P. REY, E. WOIRGARD, J.-M. THEBAUD, C. ZARDINI, Evaluation of the creep of the Sn62Pb36Ag2 solder alloy by the measurement of the stresses in a silicon die, IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 21, Issue
 [17] :  [PAP158]  -------
 [18] :  [ART570]  E. WOIRGARD, C. ZARDINI, J.-L. AUCOUTURIER, Study of the thermomechanical problems in hybrid assemblies satisfying the automotive electronics conditions, Conference Proceedings of the 9th European Hybrid Microelectronic, 2-4 June 1993, pp. 158-165.
 [19] :  [ART571]  C. ZARDINI, E. WOIRGARD, H. HUILLET, J.-L. AUCOUTURIER, Thermal simulation of hybrid power assemblies, Proceedings of the First International Conference Advanced Computational Methods in Heat Transfer, Vol. 3, 17-20 July 1990, pp. 333-342.


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