U. SCHEUERMANN, E. HERR, "A Novel Power Module Design and Technology for Improved Power Cycling Capability", ESREF'2001.

U. SCHEUERMANN, E. HERR, "A Novel Power Module Design and Technology for Improved Power Cycling Capability", ESREF'2001. Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART181]

Titre : U. SCHEUERMANN, E. HERR, A Novel Power Module Design and Technology for Improved Power Cycling Capability, ESREF'2001.

Cité dans : [DATA227] ESREF'2001, 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France , 1-5 octobre 2001.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.

Auteur : U. Scheuermann , Semikron Elektronik GmbH, Sigmundstr. 200, 90431 Nuremberg, Germany.
Auteur : E. Herr , ABB Semiconductors AG, Fabrikstr. 3,CH-5600 Lenzburg, Switzerland.

Lien : private/HERR.pdf - 6 pages, 441 Ko.
Date : 1-5 octobre 2001
Pages : 1 - 6
Switches : module IGBT
Compagnie : ABB & SEMIKRON

Abstract :
An advanced power semiconductor package design without base plate has a number of advantages compared
to standard base plate modules. It allows to use different substrate materials easily, reduces the need for
interconnections between small substrates and enables to control the interface to the heat sink by a distributed
pressure contact technology. These advantages also favourably effect the module reliability. Statistical analysis of
end-of-life active power cycling test prove the quality of the design and process capability by a narrow distribution
of end-of-life failures.

Bibliographie

References : 5
[1] : M.H.Poech, R.Eisele, A modelling approach to assess the creep behaviour of large-area solder joints, Microelectronic Reliability 40 (2000) 1653-1658.
[2] : E.Herr and S.Dewar, LoPak IGBT Modules - Inverter Reliability Benefits, Proc. PCIM, Boston (2000).
[3] : U.Hecht, U.Scheuermann, Static and Transient Thermal Resistance of Advanced Power Modules, Proc. PCIM 2001, PC 10.3, 299-305.
[4] : VDI/VDE-IT Reihe Innovationen in der Mikro-systemtechnik, Band 69, Abschlußbericht Integrierte Leistungselekronische Systeme (2000) 108-109.
[5] : M.Held, P.Jacob, G.Nicoletti, P.Scacco, M.H.Poech, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. Power Electronics and Drive Systems 1997, 425-430.

  [1] :  [ART186]  M.H. POECH, R. EISELE, A modelling approach to assess the creep behaviour of large-area solder joints, Microelectronic Reliability, Vol. 40, 2000, 1653-1658.
  [2] :  [PAP158]  -------
  [3] :  [PAP158]  -------
  [4] :  [PAP158]  -------
  [5] :  [ART258]  M. HELD, P. JACOB, G. NICOLETTI, P. SCACCO, M.-H. POECH, Fast Power Cycling Test for IGBT Modules in Traction Application, Proc. PEDS 97, 1997 , pp. 425-430.

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